Date: January 29, 2019 – January 31, 2019
Location: Santa Clara Convention Center, Santa Clara, USA
Created by engineers for engineers, DesignCon 2019 was an annual conference and expo that brought together nearly 5,000 professionals from the high-speed communications and semiconductor communities for three jam-packed days of education and activities. As the nation’s largest event for chip, board, and systems designers, DesignCon was a must-attend opportunity to share ideas, overcome challenges, and source solutions.
Where to Find Introspect Technology
We exhibited at DesignCon 2019 in booth 422.
Product Showcase: Introspect Technology C Series — SerDes Testers for the 28 Gbps to 56 Gbps Data Rate Regimes
In addition to the expo, Introspect Technology hosted a product showcase session at our booth (422) on Thursday, January 31 from 13:30 – 13:45. In this hands-on session, SerDes designers, characterization engineers, signal integrity engineers, and test engineers experienced the Introspect Technology C Series: a line of Personalized SerDes Testers covering interfaces operating in the 28 Gbps to 56 Gbps data rate regimes. Our technical experts showcased our ultra-portable, high-performance instruments and demonstrated live testing scenarios that can be executed with ease and efficiency. Read more about the product showcase here.